Graphene Microchip Powder (heat conduction type)

Model No :Jd-ft2002-99

Jd-ft2002-99 graphene flake powder is developed for high thermal conductivity composites. It is composed of graphene layered deposits with a thickness of 5-100 nm. It can greatly improve the thermal conductivity by adding it to plastics, elastomers and rubber as thermal conductive filler.

Excellent thermal conductivity

By adding jd-ft2002-99 graphene flake powder to the thermoplastic, the thermal conductivity of the graphene thermal conductive plastic can be improved dozens of times.

Good compatibility

Jd-ft2002-99 graphene microchip powder is compatible with all kinds of polymer substrates, and is suitable for melting processing methods such as extrusion, injection molding, open refining and internal mixing.

Lightweight

As a heat conducting filler, compared with the traditional metal oxide, the specific gravity is small and the weight of the product is light.